Recently, China Mobile has achieved remarkable strides in the realm of high-dimensional quantum technology. The dedicated research team has successfully engineered high-dimensional multipartite entangled states on silicon photonic quantum chips, marking a groundbreaking achievement by setting a new benchmark for scale in this cutting-edge field. This significant breakthrough not only refines and advances the theoretical underpinnings of high-dimensional quantum entangled states but also surmounts the technical hurdles associated with large-scale preparation. As a result, it offers pivotal support for the industrial deployment of quantum communication, quantum computing, and quantum precision measurement technologies.
