SK Hynix is currently weighing the option of outsourcing the production of certain base dies for its seventh-generation HBM chip, namely HBM4E, to Intel. This move is aimed at reducing its heavy dependence on TSMC's wafer foundry services. Given that TSMC's pricing for HBM4 base dies is notably higher compared to the core chips produced in-house by SK Hynix, and with costs projected to escalate further during the shift to HBM4E, along with the substantial proportion of long-term HBM supply contracts in place, the company is facing challenges in passing on these increased costs. Hence, the establishment of a multi-supplier system has become imperative to bolster its bargaining power in price negotiations.