On August 31, Xu Guojin, Deputy General Manager of Advanced Packaging Technology Development at TSMC, stated that the underlying architecture of optical transceivers is undergoing a structural transformation, with silicon photonics becoming the mainstream, and its market share is expected to exceed 50% by 2027. Silicon photonics will ultimately manifest as Co-Packaged Optics (CPO), with some manufacturers expected to commence mass production in the second half of this year.