On August 28, ECT Link, a fully-owned subsidiary of USI, announced the launch of its UHP ELSFP external light source module product line. This innovative series is designed to seamlessly integrate with NPO (Near-Packaged Optics) and CPO (Co-Packaged Optics) technologies, catering to the demands of next-generation AI computing clusters, supercomputing centers, and high-density data centers.

The ELSFP pluggable external laser source ingeniously tackles the challenges of power consumption and heat dissipation at ultra-high speeds. It achieves this by physically segregating the highly heat-sensitive laser from the core electrical chip. Moreover, it supports hot-swapping capabilities, thereby reducing operational and maintenance costs, as well as minimizing the risk of service interruptions.

This product stands as a pivotal supporting component for next-generation hyperscale data center switches with capacities of 51.2T/102.4T NPO/CPO, high-performance computing interconnection networks, and the core tiers of cloud data centers.

ECT Link has successfully completed the engineering prototypes of its ELSFP VPH and UPH series, spanning from the fourth quarter of 2025 to the second quarter of 2026. Trial production is slated to progress from the third quarter to the fourth quarter of 2026, with mass production anticipated to kick off in the first quarter of 2027.