According to reports, Samsung Electronics and SK Hynix have forged a collaborative partnership with Qualcomm to expedite the commercialization process of High Bandwidth Computing (HBC) chips. On August 26, Durga Malladi, the Executive Vice President of Qualcomm, revealed at the 'Deutsche Bank 2026 Technology Conference' that following the presentation of HBC's strengths and HBM's limitations at the investor day event, he promptly journeyed to South Korea for discussions with these two prominent memory manufacturers. At present, both Samsung Electronics and SK Hynix are making parallel strides in HBC R&D, with a primary emphasis on DRAM chip stacking. They also have plans to join forces with TSMC to merge technologies and streamline packaging processes.