Fujian: Consistently Boosting Production Capacity for 12-inch Wafers, Power Semiconductors, Analog Chips, and More
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Author:小编   

On August 27, news emerged that the People's Government of Fujian Province had unveiled the "15th Five-Year Plan for the Development of Emerging and Future Industries in Fujian Province." According to the plan, Xiamen, Quanzhou, Fuzhou, and Putian will be designated as primary areas to foster expertise in chip design, the manufacturing of specialty process chips, packaging and testing, as well as the supply of supporting equipment for components. The emphasis will be placed on the research and development of high-performance AI system-level chips (SoCs), autonomous driving chips, industrial control chips, and other related technologies, aligning proactively with the national strategic framework for AI chips. Concurrently, there will be a steady increase in production capacity for items such as 12-inch wafers, power semiconductors, and analog chips, driving the industry towards large-scale and specialized expansion. Moreover, a robust packaging and testing industry system will be established to cater to the chip demands in computing power, storage, display, and radio frequency sectors, while also strengthening the support capabilities for packaging substrates, development equipment, and other pertinent fields.

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