With the ongoing shift of AI data center interconnection technology from copper-based to optical solutions, TSMC is set to invest over NT$30 billion in acquiring AUO's two older-generation panel factories, L7 and L5C, situated in the Central Science Park. This strategic move is designed to furnish capacity support for large-scale advanced packaging technologies, including CoPoS and FOPLP, as well as facilitate the deployment of CPO technology. By capitalizing on the existing large-scale cleanrooms, substantial power allocations, and glass substrate processing capabilities of these panel factories, TSMC aims to swiftly penetrate the panel-level packaging market. This approach will not only shorten construction timelines but also reduce production costs, effectively addressing the pressing needs for ultra-large-scale packaging and high-speed optical interconnections in AI chips, which aligns with industry trends and technological advancements in the semiconductor sector.