Lei Jun has penned an article to offer a comprehensive interpretation of Xiaomi’s latest self-developed Xuanjie chip lineup, which comprises three cutting-edge chips. The flagship mobile phone SoC, the Xuanjie O3, is crafted using a 3nm process and incorporates a staggering 24 billion transistors, delivering outstanding CPU, GPU, and NPU performance. This chip is set to make its debut in the upcoming Xiaomi 18 Fold.

The Xuanjie O100, recognized as the world’s inaugural 6nm 3D wafer-level stacked AI acceleration chip, boasts exceptionally high bandwidth. When paired with the Xuanjie O3, it significantly enhances the speed of local large model inference. Meanwhile, the Xuanjie D100, China’s first 3nm high-computing-power chip designed for intelligent driving, offers robust computational capabilities and supports the deployment of extremely large models.

Xiaomi has recommenced its large-scale chip R&D efforts for more than five years, amassing a total investment exceeding 21 billion yuan. The company has assembled a research and development team of nearly 3,000 individuals. Presently, all three chips have successfully undergone tape-out verification, with the Xuanjie O100 and D100 anticipated to enter commercialization next year.