On August 24, Shanghai unveiled its "15th Five-Year Plan for Accelerating New Industrialization and Building a Modern Industrial System." The plan outlines a strategic roadmap to drive breakthroughs in integrated circuit (IC) core technologies across the entire industrial chain. By leveraging the core areas of Zhangjiang, Lingang, and Jiading, Shanghai aims to construct a world-class industrial cluster with a "one core, two wings" structure.

The plan places a strong emphasis on fortifying high-end design capabilities. It encourages the development of Electronic Design Automation (EDA) tools and Intellectual Property (IP) cores to reach global standards. To bolster industry leadership, the plan supports the cultivation of leading enterprises, accelerates industry mergers and acquisitions, and promotes the integration of the industrial chain. The goal is to elevate high-performance computing chips, general-purpose processor chips, memory chips, interconnection chips, and smart sensors to international advanced levels.

Furthermore, the plan highlights the importance of enhancing manufacturing and packaging capabilities. It calls for the expedited construction of major production line projects, driving process iterations and capacity enhancements. Specialty process development will be strengthened, and the industrialization of advanced packaging technologies will be promoted. Additionally, the plan aims to elevate the technological standards of equipment, materials, and components, fostering their systematic and platform-based development.

In summary, Shanghai's 15th Five-Year Plan represents a comprehensive effort to propel the integrated circuit industry into a new era of global competitiveness, marked by technological innovation, industrial integration, and sustainable growth.