According to a semiconductor industry research institution, once the number of layers in 3D NAND stacking surpasses approximately 300, molybdenum may replace tungsten as the preferred material for high-layer NAND. Compared to tungsten, molybdenum offers advantages in read/write speeds, process technology, and filling capabilities. It is projected that from 2025 to 2027, molybdenum's share in the global total NAND production capacity will rise from the mid-single digits to approximately 30%. By 2027, the market size for NAND molybdenum deposition equipment is expected to exceed $1 billion. If molybdenum processes are also adopted for DRAM and logic chips, the annual market size for the overall molybdenum deposition equipment market could reach approximately $2 billion by 2030. Among equipment suppliers, Lam Research will be the first to benefit, followed by Tokyo Electron, while Applied Materials, ASML, and Naura will benefit more from the subsequent demand for molybdenum processes in DRAM and logic chips.