SK Hynix is introducing advanced packaging technologies, including Intel's EMIB technology, for its next-generation High Bandwidth Memory (HBM) solutions, with plans to eventually achieve 3D packaging. At the Hot Chips 2026 conference, Jaesik Lee, Vice President of Packaging Engineering at SK Hynix, delivered a presentation on 'Advanced Packaging for High Bandwidth Memory,' outlining how the company is leveraging these technologies to accelerate the development of HBM products. Currently, SK Hynix is exploring methods such as hybrid bonding to overcome the limitations of 16-layer stacking. In the future, the company also plans to address power consumption challenges by increasing the number of Through-Silicon Vias (TSVs), enhancing the Input/Output (IO) speed of logic process integration, and optimizing the Power Distribution Network (PDN).