According to reports, TSMC is currently experiencing a significant shortage in its advanced packaging CoWoS capacity, with orders far exceeding available resources. Owing to limited back-end capacity, some orders have been redirected to Intel's Malaysian facility, which is now providing partial capacity support to serve shared major clients. This development marks a departure from established ecosystem norms within the industry. It is projected that by the end of 2026, the supply-demand gap for CoWoS will narrow from 20% to 10%, with monthly capacity potentially reaching 200,000 wafers.