During an institutional conference call, DIER LASER disclosed that applications related to TGV (Through Glass Via) span a variety of domains, including the implementation of through-vias in advanced packaging glass substrates, FAU (an unabbreviated term specific to the industry, if available, could be inserted here for clarity), and passive glass components utilized in optical communications. Glass substrates present numerous benefits and boast extensive potential for future utilization. Presently, the company's TGV equipment is apt for both wafer-level and panel-level applications. Moreover, the company has already received repeat purchase inquiries from customers specifically targeting glass substrates. Despite TGV and its derivative applications currently residing in the industry introduction phase, they are experiencing a notable surge in customer attention and market activity.