On August 19, 2026, Unified Institute Software Group Co., Ltd. (hereinafter referred to as “Unified Institute”) and Shanghai Dongfang Suanshin Technology Co., Ltd. (hereinafter referred to as “Dongfang Suanshin”) made a joint announcement. Dongfang Suanshin’s latest-generation 3D computing chip has successfully incorporated Unified Institute’s UCIe chiplet interconnect IP. After technical adjustments and collaborative verification, the two entities have surmounted several major technical hurdles associated with UCIe in 3D vertical stacking environments. This achievement has paved the way for a crucial interconnection link, facilitating the commercial launch of Dongfang Suanshin’s high-performance 3D computing chip.