On August 18th, Shijia Photonics initiated the groundbreaking ceremony for three pivotal projects in the Hebi Economic and Technological Development Zone. These projects encompass the capacity expansion of high-speed AWG chips and optical interconnect components, the industrialization of continuous-wave (CW) laser chips and COC (Chip on Carrier), and the capacity enhancement of high-density optical interconnect devices. City Party Secretary Zhao Hongyu was present at the event and officially announced the commencement of these projects. Municipal leaders Wang Qiang, Yang Jianqiang, Wang Jun, and other dignitaries also attended the ceremony. With a combined investment of 2.8 billion yuan, these projects are designed to boost the production capabilities of high-speed AWG chips, continuous-wave laser chips, and high-density optical interconnect devices. This strategic move is aimed at fulfilling the market demand for 800G/1.6T optical modules and AI computing centers, thereby propelling the advancement of the optoelectronic industry.