On August 18th, during its performance briefing, Minde Electronics revealed that it had secured a contract to expand its production capacity to 60,000 wafers monthly, with a portion of the equipment already installed and operational. Simultaneously, the company is in active negotiations with several suppliers to further boost its production capacity to 100,000 wafers per month, aiming to clinch the agreement at the earliest opportunity. The wafer fabrication capacity is projected to see a significant surge from the fourth quarter of this year through the first half of next year, with the exact timeline contingent upon the progress of equipment installation and commissioning processes.