ZILLNK has recently announced the successful closure of its Series B funding round, amassing hundreds of millions of yuan. This round was spearheaded by Shenzhen Capital Group, with significant co-investments from CDG Tech Venture, Wofu Venture Capital, and Dongshan Precision. The influx of capital will be strategically allocated towards the in-house development of core chips, advancing research and development efforts in AI-RAN and 6G technologies, as well as fueling the company's ambitious expansion into overseas markets.