Breaking Through Packaging Bottlenecks: BYD Semiconductor's SOP-9 Unlocks Next-Generation Power Device Solutions - Chip

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Breaking Through Packaging Bottlenecks: BYD Semiconductor's SOP-9 Unlocks Next-Generation Power Device Solutions

2026-08-14 / Read about 0 minute

Author：小编

BYD has successfully developed the SOP-9 packaged silicon carbide half-bridge module, featuring a top-side cooling design, integrated internal insulation, and high-precision NTC technology, achieving significant breakthroughs in power density, thermal management, and reliability.

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