Breaking Through Packaging Bottlenecks: BYD Semiconductor's SOP-9 Unlocks Next-Generation Power Device Solutions
14 hour ago / Read about 0 minute
Author:小编   

BYD has successfully developed the SOP-9 packaged silicon carbide half-bridge module, featuring a top-side cooling design, integrated internal insulation, and high-precision NTC technology, achieving significant breakthroughs in power density, thermal management, and reliability.

  • C114 Communication Network
  • Communication Home
7 X 24 Track global technological trends
Hot Topic