In an era where the application scenarios of high-end chips, such as those in AI, new energy vehicles, and 5G communications, are continuously broadening, the testing and sorting process has emerged as a pivotal factor in determining the throughput capacity of packaging plants. Whether it involves QFN power devices or BGA processors, these components must undergo stringent electrical performance tests under normal or high-temperature conditions and be accurately sorted according to the test results before they can enter the end market.