On August 13, reports emerged indicating that TSMC has recently achieved a significant breakthrough in its CoWoS advanced packaging technology within the AI chip industry. The production yield for certain products has surged to an impressive 98%-99%. According to He Jun, Vice President of Advanced Packaging Technology and Services at TSMC, this high yield primarily applies to CoWoS-packaged AI products featuring a 5.5x reticle size. At present, CoWoS packaging with a 5.5x reticle size has already entered mass production. Furthermore, it is anticipated that by 2029, the scope of CoWoS packaging will extend to encompass a 14x reticle size.