At the OCP APAC Summit, He Jun, the Vice President overseeing Advanced Packaging Technology and Services at TSMC, disclosed that certain products utilizing TSMC's mass-produced CoWoS advanced packaging technology, featuring a 5.5X reticle size, have attained an impressive yield rate of up to 99%. This 2.5D heterogeneous integration approach has undergone successful validation across a range of AI customer products, consistently achieving a stable yield surpassing 98%. Looking ahead, TSMC is set to unveil an ultra-large-scale CoWoS variant boasting a 15X reticle size by 2029. He Jun further emphasized that the validation process for advanced SoCs is rapidly evolving from a device-centric focus to a more comprehensive system-level approach, a shift propelled by the pervasive supply chain constraints plaguing the entire semiconductor sector.