Semiconductor behemoth TSMC has achieved a notable milestone in its local expansion efforts. Previously stymied by land acquisition challenges, local landowners have now shifted their positions, paving the way for TSMC to successfully acquire crucial land parcels. The company is set to build two 1.4-nanometer wafer fabrication facilities and one advanced panel-level packaging plant. TSMC projects a compound annual growth rate of 70% for its N2/A16 advanced process capacity from 2026 to 2028. By 2026, it expects monthly wafer starts for its 3-nanometer process to hit 180,000 units, with the 2-nanometer process approaching 100,000 units by year-end. Additionally, TSMC is ramping up its wafer fabs and advanced packaging plants across various global locations to cater to the surging demand for high-end AI chips and other applications.