CITIC Securities' research report highlights that advanced packaging stands as a pivotal approach to sustain the ongoing, steep performance enhancements of high-end chips. Glass substrates are poised to emerge as a crucial technology for overcoming the present limitations in advanced packaging, particularly concerning size, density, speed, and output efficiency. They are expected to enter a phase of rapid maturation and volume expansion, presenting vast market potential. Notably, the trend of glass carrier substrates penetrating the market is evident, with substantial growth prospects. Therefore, it is advisable to focus on investment opportunities within the industrial chain. Concurrently, sectors such as glass interposers and glass carriers also demonstrate significant growth potential.