According to the latest analysis by U.S. investment firm Wedbush, TSMC's 3nm process capacity is projected to expand 2 to 3 months earlier than originally planned, with monthly wafer starts increasing to 180,000 by early Q4 this year. This acceleration is primarily driven by strong orders from key customers such as NVIDIA, AMD, and Broadcom. The report also noted that TSMC's 2nm process capacity will reach approximately 50,000 to 60,000 wafers per month in the first half of 2026, with an expected increase to over 80,000 wafers by early Q4 and potentially approaching 100,000 wafers by year-end.