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Hongyuan Electronics: Intends to Secure Up to 300 Million Yuan via Private Placement to Fund Projects Including Micro-Nano System Packaging Shell Industrialization
2026-08-05 /
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Author：小编
On August 5, Hongyuan Electronics unveiled its strategy to amass funds not exceeding 300 million yuan through a streamlined private placement process. These funds are earmarked for the technological upgrade of the industrialization processes of multilayer chip ceramic capacitors and variable capacitors, the industrialization initiative for micro-nano system packaging shells, as well as to bolster working capital reserves.
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