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On July 9, The Commercial Times released a blog post revealing that NVIDIA’s upcoming next-generation Rosa CPU is anticipated to utilize TSMC’s advanced A16 process, enhanced by cutting-edge backside power delivery technology. When compared to the N2P process, the A16 process can achieve a chip density increase of up to 1.1 times. Its key enhancement stems from the integration of Super Power Rail backside power delivery technology, which relocates the power delivery network to the backside of the wafer. This innovation not only boosts power efficiency and minimizes IR drop but also optimizes frontside routing space for signal interconnections.
The Rosa CPU, positioned as the successor to the Vera CPU within the “Feynman” generation, is projected to make its debut in 2028. Plans are also underway to introduce this advanced processor to consumer PC platforms by 2030.
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