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In the A-share market, the notion of glass substrates is gaining considerable traction, drawing widespread interest within the semiconductor advanced packaging industry chain. Interviewees have highlighted that the performance and reliability of traditional organic substrates are nearing their peak capabilities, thereby propelling the industrialization journey of glass substrates forward. Numerous experts are of the opinion that the true industrial worth of glass substrates hinges on their seamless transition from demonstrating sample capabilities to achieving consistent mass production yields and securing customer orders. Notably, the TGV (Through Glass Via) process emerges as a decisive element in determining whether glass substrates can make the leap to large-scale mass production.
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