In July 2026, Guangdong Junya Electronic Technology Co., Ltd. unveiled the documentation for its inaugural extraordinary general meeting of shareholders in 2026. The focal point of this meeting will be the deliberation of a significant proposal: the investment in the development of a project aimed at producing 600,000 square meters of high-multi-layer and HDI (High-Density Interconnect) circuit boards annually. The total investment earmarked for this ambitious project amounts to 1.557 billion yuan. It is slated to be executed in two distinct phases, both of which will be undertaken within the confines of the existing factory premises by the company's wholly-owned subsidiary, Longnan Junya Electronic Technology Co., Ltd. The project is anticipated to kick off in the third quarter of 2026, with the first phase construction spanning 24 months and the subsequent phase extending over 36 months. Additionally, the meeting materials also underscored several potential risks that could surface during the course of the project's implementation.