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The General Office of the Ministry of Commerce, in collaboration with the General Office of the General Administration of Customs, has jointly released a notice to inaugurate a pilot scheme for bonded testing outside the confines of comprehensive bonded zones. This innovative pilot scheme empowers qualified enterprises, operating beyond the boundaries of comprehensive bonded zones, to seek approval for providing bonded testing services specifically for integrated circuits and consumer electronics. Nevertheless, it is strictly prohibited for these enterprises to conduct bonded testing on goods that are banned from import and export by the state. Additionally, they are barred from undertaking any repair, disassembly, scrapping, or other associated activities under the guise of bonded testing.
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