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On June 26, Zhengzhou HHGrasp Silicon Materials Co., Ltd. officially launched its Phase II 12-inch large silicon wafer production line in the Zhengzhou Airport Economy Zone. Boasting a total investment of over RMB 3 billion, this project is primarily dedicated to the research, development, and production of 12-inch monocrystalline silicon polished wafers and epitaxial wafers. It stands as a pivotal endeavor aimed at bridging the capacity gap for high-end semiconductor silicon wafers within Henan Province. The project has now entered large-scale mass production and is anticipated to achieve full operational capacity by the end of 2026, with an expected annual output of 720,000 high-end 12-inch epitaxial wafers. This development is poised to significantly enhance the domestic self-sufficiency rate for large-size, high-end silicon wafers.
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