BOE A has issued a report on its investor relations activities, disclosing that the company has been engaged in research on glass substrate carrier technology since 2020. In 2022, it made a substantial investment of RMB 390 million to set up a wafer-level innovation experimental platform that accommodates both glass and silicon substrates. By 2024, the company had further invested RMB 993 million to construct a pilot line for panel-level glass substrate packaging carriers. The installation and debugging of the main equipment are projected to be completed by 2025, with full automation equipment commissioning slated for the first half of 2026. The pilot line is designed to have a monthly production capacity of 1,000 units. To date, BOE A has successfully mastered the entire range of technologies for glass substrate packaging carriers, including TGV via formation, deep via copper filling, build-up layers, and wiring. The company aims to finalize the development and deliver samples of large-size, high-layer-count (9-2-9, 20-layer) glass substrate carrier samples by 2025. These products are mainly geared towards meeting the advanced packaging requirements for large-scale computing chips and are compatible with a variety of advanced packaging techniques. Presently, BOE A has supplied samples to certain domestic customers, with some customers having successfully completed conceptual certification and entered the technical testing phase. However, as of the current moment, this business segment has not yet commenced mass production or generated revenue from large-scale production.