On June 12, 2026, Shennan Circuits announced that it plans to raise no more than 4.882 billion yuan by issuing shares to specific objects. After deducting issuance expenses, 3.6 billion yuan will be used for the AI computing power electronic circuit product project of Wuxi Shennan Circuits, and 1.282 billion yuan will be used to supplement working capital. The project primarily produces high-speed, high-density, and multi-layer PCB products for use in AI servers, switches, and other fields, with a construction period of 1 year.
