On June 12th, the Hubei Jiangcheng Laboratory declared a major breakthrough in key capacitor technologies by successfully developing three-dimensional multilayer on-chip capacitors boasting a capacitance density of up to 1000 nanofarads per square millimeter. This technological feat can be directly integrated into high-end chips, including AI and GPU chips, as well as high-performance processors, thereby offering robust support for the development of chips that feature high computing power and low power consumption. Presently, the associated technologies are in the process of undergoing process tape-out and small-batch trial production, with intentions for large-scale deployment in the advanced packaging sector in the foreseeable future.
Capacitors function as a 'reservoir' within circuits, facilitating swift charging and discharging during periods of chip current fluctuation to stabilize voltage and guarantee that the chip receives a pristine and stable current. In computing systems, capacitors are often likened to 'electrical RAM,' working in tandem with the data buffering capabilities of HBM to collectively provide energy buffering for computing power. When the GPU's instantaneous power peaks, it relies on a multilevel power caching mechanism—spanning from nanoseconds to seconds—to ensure a continuous power supply.