Recently, LG Innotek, a prominent player in the PCB (Printed Circuit Board) and package substrate sectors in South Korea, has successfully wrapped up the expansion initiative for its factory located in Haiphong, Vietnam. Leveraging direct investment from its Vietnamese subsidiary, the project is set to kick off in July 2026 and reach completion by May 2027. The newly expanded factory will sprawl across an impressive 330,000 square meters, an expanse comparable to 45 football fields, and will be double the size of Ibiden's largest package substrate facility in Japan. Post-expansion, the Vietnamese factory will specialize in manufacturing semiconductor substrates, including Radio Frequency System-in-Package (RF-SiP), Flip-Chip Chip-Scale Package (FC-CSP), and Flip-Chip Ball Grid Array Package (FC-BGA). Meanwhile, the Gumi factory in South Korea will assume the role of the 'mother factory,' concentrating on the research and development of cutting-edge technologies and the production of high-value-added products. In contrast, the Vietnamese factory will function as a production hub for general semiconductor substrates, aiming to alleviate the persistent supply shortage in the global market.