On May 26th, Deep Technology made an announcement stating that, in response to the burgeoning demand in the high-end memory chip packaging and testing sector, its wholly-owned subsidiary, Pitton Technology (Shenzhen) Co., Ltd., along with its controlled affiliate, Hefei Pitton Storage Technology Co., Ltd., intend to collaborate on a project aimed at expanding their high-end memory chip packaging and testing capacities. The project is slated to entail a total investment of 1.47 billion yuan. This substantial sum will be allocated towards the procurement of critical equipment, including advanced chip testing machines and high-precision wafer grinding integrated systems. Additionally, the funds will support factory renovations and the establishment of essential power infrastructure to support the expanded operations.

Upon project completion, Shenzhen Pitton is projected to augment its monthly packaging capabilities by 5 million dies and enhance its testing capacity by 8 million chips. Meanwhile, Hefei Pitton Storage is anticipated to elevate its monthly packaging capacity by 28.8 million dies, thereby significantly bolstering the group's overall production and testing prowess in the high-end memory chip market.