On May 25th, DIENER LASER addressed investor inquiries on an interactive platform, revealing that its TGV laser microvia equipment is well-suited for applications in semiconductor chip packaging and display chip packaging. The company has achieved comprehensive coverage of laser technology for both wafer-level and panel-level packaging, and has successfully shipped panel-level glass substrates using its cutting-edge equipment.
In the realm of emerging display technologies, DIENER LASER capitalizes on the strengths of laser technology in handling thin films, rigid and brittle transparent materials, as well as specialized thin metal materials. The company has introduced a range of equipment, including laser repair systems for OLED and MiniLED displays, along with MicroLED laser mass transfer and welding solutions.
As of the market close on May 25th, DIENER LASER's stock price surged by 2.2%, bringing its total market capitalization to RMB 43.847 billion. Notably, the stock price has surged by more than 150% since the beginning of the year.