Recently, Empyrean made an announcement on an interactive platform, revealing that the company has taken a proactive stance in the Electronic Design Automation (EDA) sector specifically for 3D Integrated Circuit (3DIC) design. It has developed a holistic, end-to-end solution that spans from collaborative design to the verification of heterogeneous integrated 3D chips. This strategic move effectively bridges the gap in China's domestic high-end 3DIC design tools market. As a result, Empyrean has emerged as the sole provider in China equipped with full-process EDA capabilities for 3DIC design verification. The company's newly introduced Argus 3DIC physical verification platform, a pioneering product in its category, offers comprehensive support for 2.5D/3D heterogeneous integrated packaging design. This platform facilitates full-chain physical verification, covering the entire spectrum from diversified collaborative 3DIC design to the packaging stage.