At the Huawei Kunpeng Ascend Developer Conference 2026, Liao Heng, a Huawei Fellow and Lead Semiconductor Scientist, highlighted that the four key metrics of AI chips—computing power, memory bandwidth, memory capacity, and interconnect IO bandwidth—carry different weights depending on the specific application scenario. He underscored that interconnectivity is a direct determinant of the capabilities of super node systems. The Ascend 950 chip is capable of constructing super nodes that offer higher bandwidth, lower latency, and wider coverage. The overall performance of the system is the result of multiplying the scale of the super node by the performance specifications of the individual chips. Ascend fosters deep integration from chip design to software architecture, continuously refining hardware, optimizing foundational software, striking a balance between ecological compatibility and system operational efficiency, and laying a solid computing power foundation for the industry.