In May 2026, during the International Symposium on Circuits and Systems, Huawei's He Tingbo made a groundbreaking announcement. He revealed that the upcoming Kirin mobile chipset, set to be launched this autumn, will be the pioneer in integrating 'Logic Folding' technology. The Kirin 2026 (its provisional name) showcases an impressive transistor density of up to 238 million transistors per square millimeter (MTr/mm²), marking a significant 53.5% surge compared to traditional 2D designs. Notably, its P-core energy efficiency witnesses a 41% enhancement, while the peak frequency climbs by 12.7% to reach 3.1GHz, thus exceeding the 3GHz threshold for the first time (the existing Kirin 9030 operates at 2.75GHz). Additionally, Huawei shared its future blueprint, forecasting that by 2031, transistor density will soar beyond 400MTr/mm², accompanied by a main frequency hitting 5.0GHz.