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On May 22, Sanfu New Material shared the latest advancements in its premium chemicals and equipment tailored for printed circuit boards (PCBs) on the investor interaction platform. Its subsidiaries, Jiangxi Boquan and Haoyue New Material, are recognized as key players in China’s high-end PCB electroplating and electroless plating chemical sectors. They provide a comprehensive suite of processes, including horizontal and vertical copper plating, pulse copper plating, via-filling copper plating, high-aspect-ratio DC copper plating, mSAP (modified semi-additive process), packaging substrate carrier plating, and glass substrate plating. Designed specifically to meet the stringent requirements of high-frequency, high-speed, and highly reliable PCBs, these solutions are now in stable operation across more than 200 production lines.
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