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On May 21, Jiangsu Benchuan Intelligent Circuit Technology Co., Ltd. revealed that its majority-owned subsidiary, Nanjing Benchuan Pengxin Technology Co., Ltd., has entered into a Technology Development (Commission) Agreement with Xi’an Jiaotong University. The collaboration focuses on conducting specialized research and development in CIPB high-density packaging technology for power semiconductor devices, with the contract valued at RMB 500,000. The project seeks to employ multi-physics field simulations to confirm the feasibility and performance limits of embedded CIPB packaging under SiC multi-chip parallel operation scenarios. This will establish a digital foundation for the subsequent refinement of production processes, reliability assessments, and cost optimization during mass production.
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