On May 20, during the 2026 Alibaba Cloud Summit, T-Head revealed its strategic roadmap for the Zhenwu series chips. The company announced its intention to roll out two successive generations of enhanced chips—Zhenwu V900 and Zhenwu J900—within the next two years. This move is aimed at addressing the escalating AI computing demands across diverse industries in the Agentic era. In conjunction with this announcement, T-Head also introduced its latest AI chip, designed for both training and inference purposes, the Zhenwu M890. This new chip boasts a performance that is three times superior to its predecessor, the Zhenwu 810E. When integrated with T-Head's self-developed ICN Switch1.0 chip, it significantly boosts the efficiency and stability of large-scale intelligent computing clusters. To date, the cumulative shipment volume of the Zhenwu series chips has reached 560,000 units.