On May 19, Dongshan Precision revealed on an interactive platform that its 200G EML (Electro-absorption Modulated Laser) products have commenced mass production. The development of 1.6T products is progressing smoothly in accordance with the client-side work plan. Additionally, the 3.2T products are set to capitalize on Solarsense's strengths in optical chips, with a primary focus on establishing a core layout centered around 400G EML technology. The company boasts robust R&D capabilities in silicon photonics CW (Continuous Wave) laser chips. It has forged collaborations with external silicon photonics companies and successfully deployed its self-developed silicon photonics modules. Looking ahead, Dongshan Precision will maintain a dual-track approach, advancing both EML and silicon photonics technologies concurrently. By adopting a diversified strategy, the company aims to keep pace with the rapid iterations in optical interconnect technology and bolster its technological edge in the market.