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Recently, Flexium revealed during institutional research that the company is set to prioritize the development of its SMT (Surface Mount Technology) business for optical modules in 2026. The inaugural mass production line has been successfully established in Wuhan during the fourth quarter of 2025. This line is dedicated to providing SMT/SiP (System-in-Package) electronic assembly services for high-speed optical modules that incorporate FC (Flip Chip) technology. Currently, the line is in its trial production phase. Moreover, Flexium is actively collaborating with universities to research and develop high-frequency materials. The objective is to integrate these materials into the HDI (High-Density Interconnect) PCB (Printed Circuit Board) build-up process and the manufacturing of optical module circuit boards, thereby enhancing their stability and uniformity.
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