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Samsung Electronics to Set Up a New Plant in Onyang This Year, Pushing Forward with Dual-Track HBM Packaging
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Author：小编
Samsung Electronics is making significant strides in its dual-track packaging approach. This year, it will establish a new plant in Onyang, and from next year onwards, it will begin installing equipment for the sophisticated packaging production of high-bandwidth memory (HBM). This move is designed to ease the capacity constraints currently faced at its Cheonan facility. In a parallel development, the existing general-purpose DRAM packaging production line in Onyang will be shifted to Vietnam.
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