SK Hynix is teaming up with Intel in the realm of advanced packaging. The two companies are working hand - in - hand to develop 2.5D packaging technology and test integrated solutions for High - Bandwidth Memory (HBM) and system semiconductors. At present, SK Hynix is in the process of assessing the feasibility of incorporating Intel's Embedded Multi - Die Interconnect Bridge (EMIB) technology, and relevant testing has just kicked off.

This cooperation comes at a time when Taiwan Semiconductor Manufacturing Company (TSMC)'s 2.5D packaging capacity is running tight. As a result, the market is paying close attention to possible changes in the AI accelerator packaging supply chain. 2.5D packaging technology can significantly boost the connection efficiency and overall performance between chips. Currently, the global related supply chain relies heavily on TSMC's Chip - on - Wafer - on - Substrate (CoWoS) solution.

SK Hynix is procuring EMIB - equipped substrates from Intel for testing purposes, aiming to verify whether EMIB can be used for 2.5D packaging. In the meantime, SK Hynix has set up a small - scale 2.5D packaging research and development (R&D) line in South Korea.

This partnership also benefits Intel by helping it expand its advanced packaging business. Industry insiders anticipate that Intel's solution could potentially emerge as a new alternative in the 2.5D packaging supply chain for AI accelerators in the future.