SK Hynix Explores Collaboration with Intel to Introduce 2.5D Packaging to Strengthen HBM Portfolio - Chip

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SK Hynix Explores Collaboration with Intel to Introduce 2.5D Packaging to Strengthen HBM Portfolio

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Author：小编

South Korean memory giant SK Hynix is collaborating with Intel, planning to adopt Intel's EMIB 2.5D packaging technology in high-bandwidth memory (HBM) products. Given SK Hynix's commitment to diversifying its supply chain and the popularity of Intel Foundry Services in the advanced packaging sector among customers, SK Hynix has initiated R&D cooperation with Intel on 2.5D packaging technology.

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