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On May 8, 2026, the highly anticipated 2026 Mobile Cloud Summit took place in the picturesque city of Suzhou. At this significant event, Kiwi Semiconductor and China Mobile made a joint announcement, revealing a prototype verification platform designed for inter-card interconnection. This innovative platform is grounded in the OISA protocol, a cutting-edge standard in the field.
With substantial contributions from Kiwi Semiconductor, the platform's primary objective is to expedite the industrialization process of OISA standards. By doing so, it aims to foster efficient interconnection among diverse AI chip manufacturers, all operating under a unified standard. This, in turn, will lay a robust foundation for the verification and adaptation of domestic chips, propelling the industry forward.
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