In 2024, JEDEC embarked on research for the next-generation memory standard, DDR6, and finalized the preliminary draft standard by the year's end. DRAM giants including Samsung, SK Hynix, and Micron have already initiated DDR6 development, finalized prototype designs, and are now partnering with industry leaders like Intel and AMD for interface testing. DDR6 is anticipated to achieve platform certification by 2026, with server market commercialization commencing in 2027, and subsequently extending into consumer segments such as high-end notebooks. Its speed is forecasted to double or even triple that of DDR5, commencing at 8800MT/s and peaking at up to 17600MT/s, and it will adopt a multi-channel architecture.
