The Dutch lithography machine behemoth, ASML, is expanding its technological horizons into the realm of next-generation advanced packaging. Korean media outlets have reported that Professor Joo Seung-hwan of Inha University disclosed at an advanced packaging technology conference that ASML might be harnessing the technological prowess of its core lithography platform, Twinscan, to forge ahead in developing wafer-to-wafer (W2W) hybrid bonding equipment. Since its inaugural shipment in 2001, the Twinscan platform has been instrumental in ASML's high productivity, thanks to its distinctive dual-stage architecture that has significantly slashed process times. W2W hybrid bonding technology, in contrast, represents a cutting-edge packaging technique that directly fuses two semiconductor wafers, thereby shortening interconnection lengths, curbing power consumption and heat generation, while simultaneously boosting data transmission speeds. Should ASML's endeavor be confirmed, it would mark a strategic move by the company to extend its hegemony from the front-end lithography domain to the back-end advanced packaging market.